Semiconductor packaging piece burr removing device and method

• Main Authors: KIM BYOUNG-GEUN, KANG, HONG GOO
• Format: Patent
• Language: Chinese; English
• Published: 23.02.2024
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

The invention provides a burr removing device and method for a semiconductor package. The burr removing device and method can remove burrs remaining on the semiconductor package after a sputtering process for electromagnetic wave shielding is carried out. The purpose of the present invention is to simultaneously remove burrs remaining on the edge of a semiconductor package and formed so as to protrude in the horizontal direction as a whole and burrs formed so as to protrude in the vertical direction as a whole. A rotation shaft that rotates axially about an inclined rotation axis that is inclined at a first angle with respect to a bottom surface of the semiconductor package toward the edge portion of the semiconductor package; and a brush rotating device for axially rotating the inclined rotating brush in one direction or two directions. 本发明提供一种能够去除在进行用于电磁波屏蔽的溅射工序后残留于半导体封装件上的毛刺的半导体封装件毛刺去除装置及方法，可以包括：倾斜旋转刷，为了能够将残留于半导体封装件的边沿部且整体上向水平方向突出形成的毛刺以及整体上向垂直方向突出形成的毛刺同时去除，以朝着所述半导体封装件的所述边沿部相对所述半导体封装件的底面以第一角度倾斜形成的倾斜旋转轴为中心进行