Substrate feeding mechanism, plastic packaging machine and working method of plastic packaging machine

• Main Authors: JIN WEIQIANG, ZHANG LEI, XIONG XUEFEI
• Format: Patent
• Language: Chinese; English
• Published: 20.02.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; PACKING; PERFORMING OPERATIONS; PNEUMATIC TUBE CONVEYORS; SEMICONDUCTOR DEVICES; SHOP CONVEYOR SYSTEMS; STORING; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING; TRANSPORTING

The invention relates to the field of chip production, in particular to a substrate feeding mechanism, a plastic packaging machine and a working method of the plastic packaging machine. The invention provides a base plate feeding mechanism which comprises a feeding table top, a base plate feeding mechanism, a base plate feeding mechanism and a base plate feeding mechanism, wherein a feeding station is arranged on the feeding table top; a positioning mechanism and a sheet arranging mechanism are arranged on the two sides of the feeding station respectively; after the wafer box is placed on the feeding station, the wafer arranging mechanism rotates to abut against the wafer box and pushes the wafer box to tilt towards one side of the positioning mechanism. And after the wafer box inclines, the wafer arranging mechanism shrinks along the height direction, so that the substrate shakes and gets close to one side of the positioning mechanism along with the inclination direction of the wafer box. And one side of the