Electronic component and sintering method thereof

The invention belongs to the technical field of electronic ceramic material manufacturing, and particularly relates to an electronic component and a sintering method thereof. Comprising the following steps: at least preparing a coating on the inner cavity wall surface of the sagger; sintering powder...

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Main Authors ZHAO XIANGGUANG, LIU JICHAO, SHEN SHIYAO, DENG BING, WANG SHENGGANG, XIAO QIAN
Format Patent
LanguageChinese
English
Published 09.02.2024
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Abstract The invention belongs to the technical field of electronic ceramic material manufacturing, and particularly relates to an electronic component and a sintering method thereof. Comprising the following steps: at least preparing a coating on the inner cavity wall surface of the sagger; sintering powder is prepared; the coating and the sintering powder do not react with the electronic component blank in the sintering process; and placing the green body in a pretreatment sagger paved with sintering powder, paving the sintering powder on the surface of the green body, and then carrying out sintering treatment to obtain the electronic component. The coating and the sintering powder do not react with the green body in the sintering process, direct contact between the electronic component green body to be sintered and saggers such as aluminum oxide is blocked, and sintering holes are prevented from being formed in the surface of an electronic component product prepared through sintering due to the fact that the green
AbstractList The invention belongs to the technical field of electronic ceramic material manufacturing, and particularly relates to an electronic component and a sintering method thereof. Comprising the following steps: at least preparing a coating on the inner cavity wall surface of the sagger; sintering powder is prepared; the coating and the sintering powder do not react with the electronic component blank in the sintering process; and placing the green body in a pretreatment sagger paved with sintering powder, paving the sintering powder on the surface of the green body, and then carrying out sintering treatment to obtain the electronic component. The coating and the sintering powder do not react with the green body in the sintering process, direct contact between the electronic component green body to be sintered and saggers such as aluminum oxide is blocked, and sintering holes are prevented from being formed in the surface of an electronic component product prepared through sintering due to the fact that the green
Author DENG BING
ZHAO XIANGGUANG
WANG SHENGGANG
SHEN SHIYAO
LIU JICHAO
XIAO QIAN
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– fullname: XIAO QIAN
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DocumentTitleAlternate 电子元器件及其烧结方法
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Snippet The invention belongs to the technical field of electronic ceramic material manufacturing, and particularly relates to an electronic component and a sintering...
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SubjectTerms ARTIFICIAL STONE
CEMENTS
CERAMICS
CHEMISTRY
COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS
CONCRETE
LIME, MAGNESIA
METALLURGY
REFRACTORIES
SLAG
TREATMENT OF NATURAL STONE
Title Electronic component and sintering method thereof
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