Electronic component and sintering method thereof
The invention belongs to the technical field of electronic ceramic material manufacturing, and particularly relates to an electronic component and a sintering method thereof. Comprising the following steps: at least preparing a coating on the inner cavity wall surface of the sagger; sintering powder...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
09.02.2024
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Subjects | |
Online Access | Get full text |
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Summary: | The invention belongs to the technical field of electronic ceramic material manufacturing, and particularly relates to an electronic component and a sintering method thereof. Comprising the following steps: at least preparing a coating on the inner cavity wall surface of the sagger; sintering powder is prepared; the coating and the sintering powder do not react with the electronic component blank in the sintering process; and placing the green body in a pretreatment sagger paved with sintering powder, paving the sintering powder on the surface of the green body, and then carrying out sintering treatment to obtain the electronic component. The coating and the sintering powder do not react with the green body in the sintering process, direct contact between the electronic component green body to be sintered and saggers such as aluminum oxide is blocked, and sintering holes are prevented from being formed in the surface of an electronic component product prepared through sintering due to the fact that the green |
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Bibliography: | Application Number: CN202311666904 |