Electronic component and sintering method thereof

The invention belongs to the technical field of electronic ceramic material manufacturing, and particularly relates to an electronic component and a sintering method thereof. Comprising the following steps: at least preparing a coating on the inner cavity wall surface of the sagger; sintering powder...

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Bibliographic Details
Main Authors ZHAO XIANGGUANG, LIU JICHAO, SHEN SHIYAO, DENG BING, WANG SHENGGANG, XIAO QIAN
Format Patent
LanguageChinese
English
Published 09.02.2024
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Summary:The invention belongs to the technical field of electronic ceramic material manufacturing, and particularly relates to an electronic component and a sintering method thereof. Comprising the following steps: at least preparing a coating on the inner cavity wall surface of the sagger; sintering powder is prepared; the coating and the sintering powder do not react with the electronic component blank in the sintering process; and placing the green body in a pretreatment sagger paved with sintering powder, paving the sintering powder on the surface of the green body, and then carrying out sintering treatment to obtain the electronic component. The coating and the sintering powder do not react with the green body in the sintering process, direct contact between the electronic component green body to be sintered and saggers such as aluminum oxide is blocked, and sintering holes are prevented from being formed in the surface of an electronic component product prepared through sintering due to the fact that the green
Bibliography:Application Number: CN202311666904