High-thermal-conductivity and high-insulation multilayer circuit board based on soft and hard substrates and manufacturing method of high-thermal-conductivity and high-insulation multilayer circuit board

• Main Author: CAO XIAOJIN
• Format: Patent
• Language: Chinese; English
• Published: 06.02.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention provides a high-thermal-conductivity and high-insulation multilayer circuit board based on a soft and hard substrate and a manufacturing method thereof, and relates to the field of circuit boards, and the manufacturing work flow of the circuit board based on the soft and hard substrate is as follows: Sp1, preparing materials; sp2, establishing a double-layer soft board area and a soft and hard board conduction area; sp3, manufacturing a soft board; sp4, the soft board is subjected to a brownification process twice; sp5, manufacturing a conductive column on the flexible board, and reserving a buried copper groove; sp6, the surface of the soft board is coated with heat-conducting glue and processed; sp7, an insulating layer is added, and heat-conducting glue is coated; and Sp8, according to the reserved copper groove, copper blocks are filled and embedded, and processing is conducted. The problems that internal stress is formed due to different expansion coefficients generated among different mate