Wafer detection system and detection method

• Main Authors: WANG SHAOTONG, HUANG CHONGJI, ZHAO WEIWEI
• Format: Patent
• Language: Chinese; English
• Published: 02.02.2024
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TESTING

The invention relates to a wafer detection system and method, the wafer detection system comprises a carrying table, a light source module, an optical detection module and a beam splitter, the beam splitter is used for separating out reflected emergent light and a second harmonic signal from emergent light reflected from a sample to be detected, and the reflected emergent light and the second harmonic signal are transmitted to the carrying table; respectively analyzing the reflected emergent light and the second harmonic signal by using an optical detection module so as to obtain surface characteristic parameters of the to-be-detected sample according to the reflected emergent light and obtain electrical characteristic data of the to-be-detected sample according to the second harmonic signal, therefore, the wafer can be measured more accurately by integrating the surface characteristic parameters and the electrical characteristic data of the sample to be measured. When the wafer detection method based on the