Ultrasonic vibration auxiliary polishing device
The invention belongs to the technical field of silicon carbide substrate material polishing, and solves the problems of low precision and poor applicability of existing ultrasonic-assisted chemical mechanical polishing. According to the ultrasonic vibration auxiliary polishing device, an ultrasonic...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
02.02.2024
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Subjects | |
Online Access | Get full text |
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Summary: | The invention belongs to the technical field of silicon carbide substrate material polishing, and solves the problems of low precision and poor applicability of existing ultrasonic-assisted chemical mechanical polishing. According to the ultrasonic vibration auxiliary polishing device, an ultrasonic vibration unit is arranged on the front face of a rack through a cross-shaped sliding table and can transversely and vertically slide relative to the rack; the ultrasonic vibration unit comprises a stepped shaft, a main sleeve, a micro-distance adjusting mechanism and an ultrasonic longitudinal vibration mechanism; a plurality of annular plates playing a role in limiting are arranged on the inner wall of the main sleeve; the microspur adjusting mechanism and the ultrasonic longitudinal vibration mechanism are sequentially arranged in the axial direction of the stepped shaft; the micro-distance adjusting mechanism is externally connected with a piezoelectric ceramic driver, and the piezoelectric ceramic driver can |
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Bibliography: | Application Number: CN202311855119 |