Ultrasonic vibration auxiliary polishing device

• Main Authors: HE YAN, YE LINZHENG, WANG ZEXIAO, LIU YAO, CHUAI SHIDA, ZHU XIJING
• Format: Patent
• Language: Chinese; English
• Published: 02.02.2024
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The invention belongs to the technical field of silicon carbide substrate material polishing, and solves the problems of low precision and poor applicability of existing ultrasonic-assisted chemical mechanical polishing. According to the ultrasonic vibration auxiliary polishing device, an ultrasonic vibration unit is arranged on the front face of a rack through a cross-shaped sliding table and can transversely and vertically slide relative to the rack; the ultrasonic vibration unit comprises a stepped shaft, a main sleeve, a micro-distance adjusting mechanism and an ultrasonic longitudinal vibration mechanism; a plurality of annular plates playing a role in limiting are arranged on the inner wall of the main sleeve; the microspur adjusting mechanism and the ultrasonic longitudinal vibration mechanism are sequentially arranged in the axial direction of the stepped shaft; the micro-distance adjusting mechanism is externally connected with a piezoelectric ceramic driver, and the piezoelectric ceramic driver can