Printed circuit board

The invention provides a printed circuit board. The printed circuit board includes: an insulating layer having a first surface and a second surface opposite to each other in a first direction; a via hole penetrating a region between the first surface and the second surface; a first conductor layer i...

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Bibliographic Details
Main Author CHOI JIN YOUNG
Format Patent
LanguageChinese
English
Published 30.01.2024
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The invention provides a printed circuit board. The printed circuit board includes: an insulating layer having a first surface and a second surface opposite to each other in a first direction; a via hole penetrating a region between the first surface and the second surface; a first conductor layer including a first contact portion in contact with the first surface and a first non-contact portion protruding from the first contact portion in a second direction perpendicular to the first direction and disposed on the via hole; and a metal layer filling the via hole. 本公开提供一种印刷电路板。所述印刷电路板包括：绝缘层，具有在第一方向上彼此相对的第一表面和第二表面；通路孔，贯穿所述第一表面和所述第二表面之间的区域；第一导体层，包括与所述第一表面接触的第一接触部和在垂直于所述第一方向的第二方向上从所述第一接触部突出并且设置在所述通路孔上的第一非接触部；以及金属层，填充所述通路孔。
Bibliography:Application Number: CN202310387145