Integrated antenna on sidewalls of 3D stacked dies

• Main Authors: CAO LIMING, KARIKARAN SANDEEP, MAYUKA MICHAEL, SARASWATULA, DEEPAK, ZHAO ZIQUN, RAMAKRISHNAN ARUN, SHARIFI REZA
• Format: Patent
• Language: Chinese; English
• Published: 30.01.2024
• Subjects: ANTENNAS, i.e. RADIO AERIALS; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to an integrated antenna on sidewalls of a 3D stacked die. A semiconductor package with an integrated sidewall antenna is provided. An apparatus includes two or more die layers bonded together, each of the two or more die layers including a top surface, a bottom surface, and one or more sidewalls. A first sidewall of the one or more sidewalls includes a first antenna array comprising a first plurality of antenna array elements formed in at least one of the two or more die layers, where the first plurality of antenna array elements are at least partially exposed at the first sidewall. 本公开涉及3D堆叠裸片的侧壁上的集成天线。提供一种具有集成侧壁天线的半导体封装。一种设备包含接合在一起的两个或更多个裸片层，所述两个或更多个裸片层中的每一者包括顶部表面、底部表面及一或多个侧壁。所述一或多个侧壁中的第一侧壁包含第一天线阵列，所述第一天线阵列包括形成在所述两个或更多个裸片层中的至少一者中的第一多个天线阵列元件，其中所述第一多个天线阵列元件在所述第一侧壁处至少部分地暴露。