Semiconductor product production process and semiconductor product

• Main Authors: ZHOU GANG, LIU SIYONG
• Format: Patent
• Language: Chinese; English
• Published: 30.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; COLOUR PRINTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINING MACHINES; PERFORMING OPERATIONS; PRINTING; PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; SEMICONDUCTOR DEVICES; STAMPS; TRANSPORTING; TYPEWRITERS

The invention relates to the technical field of semiconductors, and particularly discloses a semiconductor product production process and a semiconductor product. The semiconductor product production technology comprises the steps that a lead frame is provided, the lead frame is provided with a plurality of base islands, and the plurality of base islands are arranged in the mode that the welding surfaces of at least two base islands are coplanar, and/or the end face, away from the welding surface, of a chip after the chip is welded is coplanar with the welding surface of at least one of the other base islands; bonding materials are arranged, the bonding materials on the coplanar welding surfaces are subjected to one-time printing processing through a steel mesh printing technology, and after the chips are welded, the end faces, away from the welding surfaces, of the chips and the bonding materials on the coplanar welding surfaces of the chips are subjected to one-time printing processing through the steel mes