Double-sided substrate boss multilayer board structure and manufacturing method thereof

• Main Authors: CHEN ZHANBO, ZHANG JUN
• Format: Patent
• Language: Chinese; English
• Published: 26.01.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention discloses a double-sided base material boss multilayer board structure and a manufacturing method thereof, and relates to the technical field of printed circuit boards, the double-sided base material boss multilayer board structure comprises a core board 1, a double-sided base material layer board and a core board 2; the core plate 1 comprises an L1 layer and an L2 layer, the core plate 2 comprises an L3 layer and an L4 layer, and a boss is arranged on the double-sided base material layer plate; the manufacturing method of the double-sided base material boss multilayer board structure comprises the following steps that S1, a core board 1 and a core board 2 are manufactured respectively; s2, manufacturing a double-sided base material laminate; s3, laminating the core plate 1, the double-sided base material layer plate and the core plate 2; s4, processing and forming the laminated core plate 1, the double-sided base material layer plate and the core plate 2; by adopting the manufacturing method pr