Package, semiconductor package and method of forming same
A semiconductor package includes: a first interposer including: a first substrate; a first optical component over the first substrate; a first dielectric layer over the first optical element; and a first conductive connector embedded in the first dielectric layer, a photonic package bonded to a firs...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
26.01.2024
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor package includes: a first interposer including: a first substrate; a first optical component over the first substrate; a first dielectric layer over the first optical element; and a first conductive connector embedded in the first dielectric layer, a photonic package bonded to a first side of the first interposer, where a first bond between the first interposer and the photonic package includes a dielectric-to-dielectric bond between the second dielectric layer on the photonic package and the first dielectric layer, and a second bond between the first interposer and the photonic package includes a metal-to-metal bond between the second conductive connectors on the photonic package and a first one of the first conductive connectors, and a first die bonded to a first side of the first interposer. The embodiment of the invention also relates to a package and a method of forming the semiconductor package.
半导体封装件,包括:第一中介层,包括:第一衬底;第一光学组件,位于第一衬底上方;第一介电层,位于第一光学组件上方;以及第一导电连接件,嵌入在第一介电层中;光子封装件,接合至第一中介层的第 |
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Bibliography: | Application Number: CN202311147340 |