Package, semiconductor package and method of forming same

• Main Authors: XIA XINGGUO, CHAO RUILIN, ZENG ZHIWEI, YU ZHENHUA
• Format: Patent
• Language: Chinese; English
• Published: 26.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor package includes: a first interposer including: a first substrate; a first optical component over the first substrate; a first dielectric layer over the first optical element; and a first conductive connector embedded in the first dielectric layer, a photonic package bonded to a first side of the first interposer, where a first bond between the first interposer and the photonic package includes a dielectric-to-dielectric bond between the second dielectric layer on the photonic package and the first dielectric layer, and a second bond between the first interposer and the photonic package includes a metal-to-metal bond between the second conductive connectors on the photonic package and a first one of the first conductive connectors, and a first die bonded to a first side of the first interposer. The embodiment of the invention also relates to a package and a method of forming the semiconductor package. 半导体封装件，包括：第一中介层，包括：第一衬底；第一光学组件，位于第一衬底上方；第一介电层，位于第一光学组件上方；以及第一导电连接件，嵌入在第一介电层中；光子封装件，接合至第一中介层的第