Electronic device housing incorporating different metals, and method for manufacturing same

• Main Authors: LEE YUN-HEE, SIN CHUNOL, BAEK SEUNGANG, CHO SUNG HO, HWANG HAN GYU, KIM YOUNG-OH
• Format: Patent
• Language: Chinese; English
• Published: 19.01.2024
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A case of an electronic device may include: two or more metal portions each having an oxide film layer formed on a surface thereof; and a non-conductive portion formed to cover at least a portion of the oxide film layer. 电子设备的壳体可包括：两个或更多个金属部分，各自具有形成在其表面上的氧化物膜层；以及形成为覆盖所述氧化物膜层的至少一部分的非导电部分。