Method and system for intelligently controlling thickness of de-bonding layer and production equipment
The invention provides a method and a system for intelligently controlling the thickness of a de-bonding layer and production equipment, and relates to the technical field of de-bonding layer production. The method for intelligently controlling the thickness of the de-sticking layer comprises the fo...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
19.01.2024
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a method and a system for intelligently controlling the thickness of a de-bonding layer and production equipment, and relates to the technical field of de-bonding layer production. The method for intelligently controlling the thickness of the de-sticking layer comprises the following steps: acquiring the thickness of a PET release film, the viscosity of a de-sticking agent, a first initial value of a feeding gap and a second initial value of a thickness control interval, and predicting the thickness of the de-sticking layer based on a dynamic prediction model to obtain a predicted value; according to the predicted value and a target value of the thickness of the de-bonding layer, calculating a deviation value of the thickness of the de-bonding layer; and a first adjustment value of the feeding gap and a second adjustment value of the thickness control interval are obtained according to the deviation value, the feeding gap is adjusted according to the first adjustment value, and the thic |
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Bibliography: | Application Number: CN202311714744 |