Method and system for intelligently controlling thickness of de-bonding layer and production equipment

The invention provides a method and a system for intelligently controlling the thickness of a de-bonding layer and production equipment, and relates to the technical field of de-bonding layer production. The method for intelligently controlling the thickness of the de-sticking layer comprises the fo...

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Bibliographic Details
Main Authors TANG FENGJIAO, REN JUN, TANG XINKAI, XU WEIFU
Format Patent
LanguageChinese
English
Published 19.01.2024
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Summary:The invention provides a method and a system for intelligently controlling the thickness of a de-bonding layer and production equipment, and relates to the technical field of de-bonding layer production. The method for intelligently controlling the thickness of the de-sticking layer comprises the following steps: acquiring the thickness of a PET release film, the viscosity of a de-sticking agent, a first initial value of a feeding gap and a second initial value of a thickness control interval, and predicting the thickness of the de-sticking layer based on a dynamic prediction model to obtain a predicted value; according to the predicted value and a target value of the thickness of the de-bonding layer, calculating a deviation value of the thickness of the de-bonding layer; and a first adjustment value of the feeding gap and a second adjustment value of the thickness control interval are obtained according to the deviation value, the feeding gap is adjusted according to the first adjustment value, and the thic
Bibliography:Application Number: CN202311714744