Optical device and manufacturing method thereof
According to an embodiment of the present application, an optical device and a method of manufacturing the same are presented in which an opening is formed in a first semiconductor device and then bonded to other optical devices. A laser die or other fill material may be used to refill the opening....
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| Main Authors | , , |
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| Format | Patent |
| Language | Chinese English |
| Published |
19.01.2024
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| Subjects | |
| Online Access | Get full text |
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| Abstract | According to an embodiment of the present application, an optical device and a method of manufacturing the same are presented in which an opening is formed in a first semiconductor device and then bonded to other optical devices. A laser die or other fill material may be used to refill the opening. The first semiconductor device is then electrically connected to the optical interposer.
根据本申请的实施例，提出了光学器件及其制造方法，其中在第一半导体器件内形成开口，然后接合至其他光学器件。激光管芯或其他填充材料可以用于重新填充开口。然后将第一半导体器件电连接至光学中介层。 |
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| AbstractList | According to an embodiment of the present application, an optical device and a method of manufacturing the same are presented in which an opening is formed in a first semiconductor device and then bonded to other optical devices. A laser die or other fill material may be used to refill the opening. The first semiconductor device is then electrically connected to the optical interposer.
根据本申请的实施例，提出了光学器件及其制造方法，其中在第一半导体器件内形成开口，然后接合至其他光学器件。激光管芯或其他填充材料可以用于重新填充开口。然后将第一半导体器件电连接至光学中介层。 |
| Author | XIA XINGGUO YU ZHENHUA CHAO RUILIN |
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| DocumentTitleAlternate | 光学器件及其制造方法 |
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| Notes | Application Number: CN202311103784 |
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| RelatedCompanies | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD |
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| Snippet | According to an embodiment of the present application, an optical device and a method of manufacturing the same are presented in which an opening is formed in... |
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| SubjectTerms | OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS |
| Title | Optical device and manufacturing method thereof |
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