Optical device and manufacturing method thereof
According to an embodiment of the present application, an optical device and a method of manufacturing the same are presented in which an opening is formed in a first semiconductor device and then bonded to other optical devices. A laser die or other fill material may be used to refill the opening....
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Format | Patent |
Language | Chinese English |
Published |
19.01.2024
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Online Access | Get full text |
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Abstract | According to an embodiment of the present application, an optical device and a method of manufacturing the same are presented in which an opening is formed in a first semiconductor device and then bonded to other optical devices. A laser die or other fill material may be used to refill the opening. The first semiconductor device is then electrically connected to the optical interposer.
根据本申请的实施例,提出了光学器件及其制造方法,其中在第一半导体器件内形成开口,然后接合至其他光学器件。激光管芯或其他填充材料可以用于重新填充开口。然后将第一半导体器件电连接至光学中介层。 |
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AbstractList | According to an embodiment of the present application, an optical device and a method of manufacturing the same are presented in which an opening is formed in a first semiconductor device and then bonded to other optical devices. A laser die or other fill material may be used to refill the opening. The first semiconductor device is then electrically connected to the optical interposer.
根据本申请的实施例,提出了光学器件及其制造方法,其中在第一半导体器件内形成开口,然后接合至其他光学器件。激光管芯或其他填充材料可以用于重新填充开口。然后将第一半导体器件电连接至光学中介层。 |
Author | XIA XINGGUO YU ZHENHUA CHAO RUILIN |
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DocumentTitleAlternate | 光学器件及其制造方法 |
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Notes | Application Number: CN202311103784 |
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Snippet | According to an embodiment of the present application, an optical device and a method of manufacturing the same are presented in which an opening is formed in... |
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Title | Optical device and manufacturing method thereof |
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