Optical device and manufacturing method thereof

According to an embodiment of the present application, an optical device and a method of manufacturing the same are presented in which an opening is formed in a first semiconductor device and then bonded to other optical devices. A laser die or other fill material may be used to refill the opening....

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Bibliographic Details
Main Authors XIA XINGGUO, CHAO RUILIN, YU ZHENHUA
Format Patent
LanguageChinese
English
Published 19.01.2024
Subjects
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Summary:According to an embodiment of the present application, an optical device and a method of manufacturing the same are presented in which an opening is formed in a first semiconductor device and then bonded to other optical devices. A laser die or other fill material may be used to refill the opening. The first semiconductor device is then electrically connected to the optical interposer. 根据本申请的实施例，提出了光学器件及其制造方法，其中在第一半导体器件内形成开口，然后接合至其他光学器件。激光管芯或其他填充材料可以用于重新填充开口。然后将第一半导体器件电连接至光学中介层。
Bibliography:Application Number: CN202311103784