Micro LED transfer method

• Main Authors: HUANG BAIYUAN, CHEN LU, PENG XINHAN, CHEN QIUXING
• Format: Patent
• Language: Chinese; English
• Published: 16.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to the technical field of micro light emitting diodes, and discloses a micro LED transfer method. The micro LED transfer method comprises the following steps: providing a chip carrier plate with a plurality of micro light-emitting diodes and a temporary substrate, wherein the temporary substrate comprises a substrate, a transfer layer and a bearing layer which are arranged in sequence; transferring the plurality of micro light-emitting diodes on the chip carrier plate to the temporary substrate, wherein the bearing layer comprises a first part covered by the micro light-emitting diodes and a second part positioned between the adjacent micro light-emitting diodes; patterning the receiving layer, and removing the second part of the receiving layer; processing the transfer layer in the corresponding area of the target micro light-emitting diode on the temporary substrate to enable the temporary substrate to release the target micro light-emitting diode; and transferring the target micro lig