Wire bonding system including wire biasing tool

• Main Authors: MUI MAN KIT, WU GUANMIN
• Format: Patent
• Language: Chinese; English
• Published: 16.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A wire bonding system has a bonding tool and a wire guide, where the wire guide is used to guide a bonding wire to a tip of the bonding tool for wire bonding operations. A lead biasing tool is positioned adjacent the lead guide, and a rotary actuator is operably connected to the lead biasing tool through a linkage mechanism. The rotary actuator is operable to move the wire biasing tool along a predetermined path of travel to apply a biasing force to a length of bonding wire extending from a tip of the bonding tool. 一种引线键合系统，其具有键合工具和引线导向器，其中，该引线导向器用于将键合引线引导到该键合工具的尖端以进行引线键合操作。引线偏置工具邻接所述引线导向器放置，旋转致动器通过联动机构可操作地连接到该引线偏置工具。所述旋转致动器可操作地沿着预定行进路径移动所述引线偏置工具，以将偏置力施加至从所述键合工具的尖端延伸出的一段键合引线上。