Low-profile antenna flexible interconnection structure

• Main Authors: ZHANG YUZHOU, ZHAN CHANGJI, ZHENG JINGXIN, WANG BO
• Format: Patent
• Language: Chinese; English
• Published: 12.01.2024
• Subjects: ANTENNAS, i.e. RADIO AERIALS; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a flexible interconnection structure of a low-profile antenna. The flexible interconnection structure comprises an antenna array surface; the plurality of antenna array surfaces are arranged and spliced to form a sheet structure; the antenna array plane comprises a unit comprehensive plate and a structural plate; a volume cavity is formed between the unit integrated board and the structural board, and a flexible interconnection layer and a chip type power chip are arranged on the inner side of the volume cavity; the flexible interconnection layer and the chip type power chip are in press fit contact and are integrally arranged on the inner side of the antenna array surface; the unit integrated board, the flexible interconnection layer, the chip type power chip and the structural board are detachably connected; the structure is composed of a unit integrated board, a flexible interconnection layer, a chip type power chip and a structural board. Through the flexible interconnection layer,