Package and method of forming same

• Main Authors: XIA XINGGUO, CHAO RUILIN, YU ZHENHUA
• Format: Patent
• Language: Chinese; English
• Published: 12.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES

The method includes patterning a top silicon layer in a substrate to form a plurality of photonic devices. The substrate includes a top silicon layer, a first dielectric layer underlying the top silicon layer, and a semiconductor layer underlying the first dielectric layer. The method further includes forming a second dielectric layer to embed the plurality of photonic devices therein; forming an interconnect structure over the plurality of photonic devices that is signal-coupled to the plurality of photonic devices; bonding the electron die to the interconnect structure; thinning the semiconductor layer; and patterning the thinned semiconductor layer to form an opening. The opening is filled with a dielectric material to form a dielectric region. A via penetrating the dielectric region is formed to electrically couple to the interconnect structure. The embodiment of the invention also relates to a package and a method of forming the same. 方法包括：图案化衬底中的顶部硅层以形成多个光子器件。衬底包括顶部硅层、位于顶部硅层下方的第一介电层以及位于第一介电层下方的半导体层。方法还包