Heat dissipation cover assembly and heat dissipation equipment

• Main Authors: ZHANG KUO, PAN SANMING, LIU WENRUI, YAN YAQI, RAN PEI, SONG ZHIQI, YUAN MINGQIANG, ZHANG WENLONG, ZHANG ZHENYANG, DONG YUCHI
• Format: Patent
• Language: Chinese; English
• Published: 09.01.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention provides a heat dissipation cover assembly and heat dissipation equipment, and the heat dissipation cover assembly is characterized in that a cover body comprises a first side plate, a second side plate and a connecting plate, the first side plate and the second side plate are connecte...