Heat dissipation cover assembly and heat dissipation equipment

• Main Authors: ZHANG KUO, PAN SANMING, LIU WENRUI, YAN YAQI, RAN PEI, SONG ZHIQI, YUAN MINGQIANG, ZHANG WENLONG, ZHANG ZHENYANG, DONG YUCHI
• Format: Patent
• Language: Chinese; English
• Published: 09.01.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention provides a heat dissipation cover assembly and heat dissipation equipment, and the heat dissipation cover assembly is characterized in that a cover body comprises a first side plate, a second side plate and a connecting plate, the first side plate and the second side plate are connected through the connecting plate so as to form a containing groove in an enclosing manner, and the first side plate and the second side plate are oppositely arranged; the end face, located on one side of the containing groove, of the connecting plate is provided with a containing groove matched with the heat conduction piece, and the heat conduction piece is arranged in the containing groove. The heat conduction plate is fixedly connected with the end face, located on one side of the containing groove, of the connecting plate, the heat conduction plate covers part of the area of the containing groove so that the heat conduction piece can be limited in the containing groove, and the heat conductor is fixedly connected