Light emitting diode chip and preparation method thereof

• Main Author: LIN QINGBIAO
• Format: Patent
• Language: Chinese; English
• Published: 09.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a light emitting diode chip and a preparation method thereof. The light-emitting diode chip comprises a light-emitting laminated structure; the omni-directional reflecting mirror at least covers part of the upper surface of the light-emitting laminated structure; the omni-directional reflector comprises a first reflecting layer and a second reflecting layer. The first reflecting layer is located on the upper surface of the light-emitting laminated structure, and the first reflecting layer comprises a plurality of pattern structures which are arranged at intervals; the second reflecting layer is located on the upper surface of the light-emitting laminated structure and covers the first reflecting layer. The omnibearing reflector can improve the reflectivity of the light-emitting diode chip, thereby improving the brightness of the light-emitting diode chip. The first reflecting layer comprises a plurality of pattern structures which are arranged at intervals, so that the influence on a