Novel foldable liquid-cooling cold plate

The invention relates to the technical field of heat dissipation of electronic components, in particular to a novel foldable liquid-cooling cold plate which comprises a heat dissipation assembly, a rotating column, a first cold plate, a second cold plate and a telescopic corrugated pipe, and the rot...

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Bibliographic Details
Main Authors LYU WENYU, ZOU YOUXIN, ZHOU NIANYONG, ZHAO YINGJIE, BAO QINGGUO, TANG GUANGHUA
Format Patent
LanguageChinese
English
Published 05.01.2024
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Summary:The invention relates to the technical field of heat dissipation of electronic components, in particular to a novel foldable liquid-cooling cold plate which comprises a heat dissipation assembly, a rotating column, a first cold plate, a second cold plate and a telescopic corrugated pipe, and the rotating column is arranged between the first cold plate and the second cold plate and fixedly connected with the first cold plate and the second cold plate. The rotating column is connected with the first cold plate and the second cold plate through the corrugated pipe, and when the first cold plate and the second cold plate rotate at different angles along the rotating groove, a cooling working medium enters from an inlet of the rotating column, exits from the circulation connecting port and then enters an inlet of the first cold plate and an inlet of the second cold plate through the corrugated pipe. The liquid-cooling cold plate flows through the flow channel in the cold plate, then flows out of the outlet of the
Bibliography:Application Number: CN202311233183