Packaging film, preparation method, packaging method and display module

• Main Authors: ZHU SHAOWU, ZHANG JINGANG, SUN TIANPENG
• Format: Patent
• Language: Chinese; English
• Published: 05.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a packaging film, a preparation method, a packaging method and a display module. The packaging film comprises a light diffusion layer, a coloring layer, an anti-dazzle layer and a semi-cured transparent adhesive layer. The light diffusion layer is used for diffusing light; the coloring layer is arranged on one side of the light diffusion layer; the anti-dazzle layer is arranged on the side, away from the light diffusion layer, of the coloring layer and used for reducing dazzle and light reflection. The semi-cured transparent adhesive layer is arranged on the side, away from the coloring layer, of the light diffusion layer and used for bonding a lamp panel and the light diffusion layer. The total thickness of the packaging film is small, it can be guaranteed that the packaging film cannot shield the light-emitting angle of the light source at the splicing position of the display module, then it is guaranteed that no dark line is generated at the splicing position of the display module, a