Metallization method
Disclosed herein is a metallization process comprising (a) forming an underlayer on a first surface of a substrate from an underlayer composition comprising: a first polymer comprising an acid-labile group and a sensitizing group wherein (i) the first polymer contains a sensitizing group or (ii) a c...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
05.01.2024
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Subjects | |
Online Access | Get full text |
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Summary: | Disclosed herein is a metallization process comprising (a) forming an underlayer on a first surface of a substrate from an underlayer composition comprising: a first polymer comprising an acid-labile group and a sensitizing group wherein (i) the first polymer contains a sensitizing group or (ii) a compound different from the first polymer contains a sensitizing group; wherein the bottom layer has a first thickness; (b) forming a photoresist layer from a photoresist composition on the underlayer, the photoresist composition comprising: a second polymer containing an acid labile group, and a photoacid generator; wherein the photoresist layer has a second thickness; (c) patterning the photoresist layer to an activation radiation; and (d) developing the exposed photoresist layer with an alkaline developer.
本文公开了一种金属化方法,其包括(a)在基底的第一表面上由底层组合物形成底层,该底层组合物包含:含有酸不稳定基团和敏化基团的第一聚合物,其中(i)第一聚合物含有敏化基团或者(ii)不同于第一聚合物的化合物含有敏化基团;其中底层具有第一厚度;(b)在底层上由光致抗蚀剂组合物形成光致抗蚀剂层,该光致抗蚀剂组合物包含:含有酸不稳定基团的第二聚合物、和光酸产生剂;其中光致抗蚀剂层具有第二厚度;(c)将光致抗蚀剂层以图案方式暴 |
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Bibliography: | Application Number: CN202310777753 |