Height compensation method and device of printing platform and computer equipment

• Main Authors: WANG YULONG, TANG JINGKE
• Format: Patent
• Language: Chinese; English
• Published: 05.01.2024
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention relates to a height compensation method and device of a printing platform and computer equipment. The method comprises the following steps: determining a to-be-compensated measurement point in a printing platform and a plurality of adjacent areas located at adjacent positions of the to-be-compensated measurement point in the printing platform; each adjacent area comprises at least two adjacent measuring points; projecting at least two adjacent measurement points in each adjacent area to a preset first projection plane to obtain at least two first projection points, and performing linear fitting processing on the at least two first projection points to obtain a first fitting line corresponding to each adjacent area; respectively determining each compensation reference point according to the first fitting line corresponding to each adjacent area; and projecting each compensation reference point to a preset second projection plane to obtain each second projection point, and performing height compen