Semiconductor wafer cleaning apparatus, semiconductor wafer cleaning method, and silicon wafer manufacturing method

• Main Authors: OKUDA KOICHI, TOMITA MICHIHIKO, TAKEMURA MAKOTO, YAMAURA DAICHI, OKUBO TOMOHIRO, NODA KAITO
• Format: Patent
• Language: Chinese; English
• Published: 29.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a cleaning device for a semiconductor wafer, which can inhibit particles from being generated on the back surface of the semiconductor wafer. The semiconductor wafer cleaning device (1) comprises: a rotary table (11) having an opening (11a) in the center thereof; a wafer holding unit which is provided on the upper surface of the rotary table (11) and holds a semiconductor wafer (W) to be cleaned; a return part (21) provided on the lower surface of the rotary table; a nozzle head (14) having a recessed portion (14a) disposed in the center and a horizontal portion (14b) disposed on the outside in the radial direction of the recessed portion (14a); a lower chemical solution supply nozzle (15) for supplying a chemical solution to the back surface of the semiconductor wafer (W); and a wafer back surface flushing nozzle (16) for supplying pure water to the back surface of the semiconductor wafer (W), in which the return part (21) is disposed in the vicinity of the opening (11a), and a return