Substrate for semiconductor device

A substrate for a semiconductor device. A disclosure is provided for optimizing the number of semiconductor devices on a chip/substrate. The optimization includes efficiently arranging, cutting and packaging the devices. 一种用于半导体装置的衬底。所提供为用于优化芯片/衬底上的半导体装置的数目的揭示。所述优化包括有效率地布置、切割和包装所述装置。...

Full description

Saved in:
Bibliographic Details
Main Authors RINNE, GLENN, RICHERT, DANIEL
Format Patent
LanguageChinese
English
Published 26.12.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A substrate for a semiconductor device. A disclosure is provided for optimizing the number of semiconductor devices on a chip/substrate. The optimization includes efficiently arranging, cutting and packaging the devices. 一种用于半导体装置的衬底。所提供为用于优化芯片/衬底上的半导体装置的数目的揭示。所述优化包括有效率地布置、切割和包装所述装置。
Bibliography:Application Number: CN202311287717