Wafer de-bonding device and de-bonding method

• Main Authors: WEN MING, CHEN WANQUN, CHEN JIN, QI JIAHONG, WANG ZHENGGEN, JIANG MIN
• Format: Patent
• Language: Chinese; English
• Published: 26.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a wafer de-bonding device and a de-bonding method, which are used for de-bonding a workpiece, the workpiece comprises an upper wafer and a lower wafer which are bonded together, the wafer de-bonding device comprises a first adsorption assembly, a first driving piece and a clamping assembly used for clamping the upper wafer, the clamping assembly comprises a first side part along a second direction, and the first side part is provided with a first side surface and a second side surface; the first adsorption assembly comprises a moving driving piece and a first adsorption piece, the first adsorption piece is used for adsorbing the bottom of the lower wafer, the moving driving piece is connected with the first adsorption piece so as to drive the first adsorption piece to move towards the side away from the upper wafer in the first direction, and the first driving piece is connected with the first side part of the clamping assembly so as to drive the clamping assembly to move towards the