Method for mounting electronic component on substrate by sintering

The invention relates to a method for mounting an electronic component (28) onto a substrate (30), the method comprising the following consecutive steps: depositing a sintered material (26) onto one of the electronic component (28) and the substrate (30); heating the sintered material (26) such that...

Full description

Saved in:
Bibliographic Details
Main Authors RIOU JEANRISTOPHE, PONCE, CORINNE, JESSANT, ALAIN
Format Patent
LanguageChinese
English
Published 22.12.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:The invention relates to a method for mounting an electronic component (28) onto a substrate (30), the method comprising the following consecutive steps: depositing a sintered material (26) onto one of the electronic component (28) and the substrate (30); heating the sintered material (26) such that the temperature of the sintered material (26) reaches a preliminary exothermic peak (8) prior to the exothermic sintering peak (10), while the temperature of the sintered material (26) does not reach a maximum of the preliminary exothermic peak (8); fastening the other of the electronic component (28) and the substrate (30) to the sintered material (26) such that the sintered material is interposed between the electronic component (28) and the substrate (30); and pressing the sintered material (26) while hot to creep the sintered material (26). Subsequently, a step of sintering the sintered material (26) may be performed. The preliminary exothermic peak (8) is a marker to activate flakes of the sintered material (
Bibliography:Application Number: CN202280033766