Developing machine for improving non-falling of printing ink in PCB (Printed Circuit Board) solder mask hole during development

• Main Authors: LIU SANBO, LIU SONGLING, ZHANG LI, LIU XIONG
• Format: Patent
• Language: Chinese; English
• Published: 05.12.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; CLEANING; CLEANING IN GENERAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PREVENTION OF FOULING IN GENERAL; PRINTED CIRCUITS; TRANSPORTING

The invention discloses a developing machine for improving non-falling of printing ink in a PCB (Printed Circuit Board) solder mask hole, which relates to the technical field of developing machines and comprises a device body, a scraping device and a positioning device, wherein a cover plate is rotatably mounted at the top of the device body, a liquid frame is fixedly mounted on the left side of the device body, and a placement groove is formed in the top of the device body; wherein the scraping device comprises a sealing frame and a scraping assembly, the sealing frame is fixedly installed in the device body, the scraping assembly comprises a rotating shaft, expansion rubber, a scraping plate, a contact rod, an electric push rod, a push rod and a sleeve block, the rotating shaft is arranged at the top of the rotating shaft, and the rotating shaft is connected to the inner wall and the outer wall of the sealing frame in a penetrating and sleeving mode. The expansion rubber is fixedly installed on the surface