Microelectronic assembly with glass substrate and magnetic core inductor

• Main Authors: TADAYON PAMELA, IBRAHIM TAHER A, PIETAMBARAM SRINIVAS V, BHARATH KRISHNA, VADLAMANI SAI
• Format: Patent
• Language: Chinese; English
• Published: 01.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Microelectronic assemblies, related devices and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a glass substrate having a plurality of conductive through glass vias (TGVs); a magnetic core inductor including a first conductive TGV at least partially surrounded by a magnetic material and a second conductive TGV electrically coupled to the first TGV; a first die in a first dielectric layer, where the first dielectric layer is on the glass substrate; and a second die in a second dielectric layer, where the second dielectric layer is on the first dielectric layer, and where the second die is electrically coupled to the magnetic core inductor. 本文公开了微电子组件、相关装置和方法。在一些实施例中，微电子组件可以包括：具有多个导电穿玻璃过孔(TGV)的玻璃衬底；磁芯电感器，包括至少部分地被磁性材料围绕的第一导电TGV以及电耦合到第一TGV的第二导电TGV；在第一电介质层中的第一管芯，其中，第一电介质层在玻璃衬底上；以及在第二电介质层中的第二管芯，其中，第二电介质层在第一电介质层上，并且其中，第二管芯电耦合到磁芯电感器。