Heat dissipation device

• Main Authors: JANG SANG-WOONG, XU HETONG, LI YI, WANG ZEQIN
• Format: Patent
• Language: Chinese; English
• Published: 01.12.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention relates to a heat dissipation device. The heat dissipation device comprises an evaporator, a condenser and a heat conduction pipe set. The evaporator is provided with an evaporation cavity, the condenser and the evaporator are arranged in a spaced mode, and the condenser is provided wi...