Heat dissipation device

The invention relates to a heat dissipation device. The heat dissipation device comprises an evaporator, a condenser and a heat conduction pipe set. The evaporator is provided with an evaporation cavity, the condenser and the evaporator are arranged in a spaced mode, and the condenser is provided wi...

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Bibliographic Details
Main Authors JANG SANG-WOONG, XU HETONG, LI YI, WANG ZEQIN
Format Patent
LanguageChinese
English
Published 01.12.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The invention relates to a heat dissipation device. The heat dissipation device comprises an evaporator, a condenser and a heat conduction pipe set. The evaporator is provided with an evaporation cavity, the condenser and the evaporator are arranged in a spaced mode, and the condenser is provided with a condensation cavity. The heat conduction pipe set is connected between the evaporator and the condenser and comprises a first guide pipe, a second guide pipe, a first one-way valve and a second one-way valve. The first guide pipe communicates with the evaporation cavity and the condensation cavity, and the second guide pipe communicates with the evaporation cavity and the condensation cavity. The first one-way valve is arranged on the first guide pipe and used for limiting a medium in the first guide pipe to move in the first direction, and the first direction is the direction from the evaporation cavity to the condensation cavity; the second one-way valve is arranged on the second guide pipe and used for limi
Bibliography:Application Number: CN202210564759