Semiconductor laser wafer expander and use method thereof
The invention discloses a semiconductor laser wafer expander and a use method thereof. The wafer expanding machine comprises a wafer expanding machine main body, a fixing support and a mechanical arm, and the mechanical arm is arranged on the wafer expanding machine main body through the fixing supp...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
01.12.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses a semiconductor laser wafer expander and a use method thereof. The wafer expanding machine comprises a wafer expanding machine main body, a fixing support and a mechanical arm, and the mechanical arm is arranged on the wafer expanding machine main body through the fixing support in an up-and-down moving mode. A camera module is arranged in the mechanical arm, and the camera module moves to a first preset position through the mechanical arm so as to monitor the laminating effect of a chip unit on the surface of a wafer and a wafer expanding film; a heating array module capable of moving up and down is arranged in the wafer expanding machine main body, and the heating array module moves to be attached to the wafer expanding film, so that the non-attached part of the wafer expanding film can be selectively heated, and the complete attachment of the wafer core unit and the wafer expanding film is realized. According to the wafer expanding machine, the camera module is used for observing th |
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Bibliography: | Application Number: CN202210519907 |