Wafer and wafer processing method

• Main Authors: SAKAMOTO TAKESHI, YAMAMOTO KAZUMA, NAGURA KEISUKE
• Format: Patent
• Language: Chinese; English
• Published: 28.11.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a wafer and a wafer processing method. A wafer in which a plurality of semiconductor chips are obtained by performing an expansion step after forming a modified region along a line, the wafer having a plurality of chip regions divided by chip division lines as lines, the chi...