Thermosetting resin composition, dry film, cured product, printed wiring board, and electrical/electronic component

• Main Authors: GUAN ZHONG, KANAZAWA YASUYO, NAKADA KAZUKI, NAKAI KOSHIN
• Format: Patent
• Language: Chinese; English
• Published: 24.11.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention provides a thermosetting resin composition capable of easily singulating chips in a step for sealing a plurality of chips together using the thermosetting resin composition and then singulating the chips one by one in the manufacture of a SAW filter. The thermosetting resin com...