Thermosetting resin composition, dry film, cured product, printed wiring board, and electrical/electronic component

• Main Authors: GUAN ZHONG, KANAZAWA YASUYO, NAKADA KAZUKI, NAKAI KOSHIN
• Format: Patent
• Language: Chinese; English
• Published: 24.11.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention provides a thermosetting resin composition capable of easily singulating chips in a step for sealing a plurality of chips together using the thermosetting resin composition and then singulating the chips one by one in the manufacture of a SAW filter. The thermosetting resin composition according to the present invention is a thermosetting resin composition containing a thermosetting resin, and is characterized in that a cured product obtained by heating the thermosetting resin composition at 100 DEG C for 30 minutes and then heating the thermosetting resin composition at 180 DEG C for 60 minutes and curing the thermosetting resin composition satisfies the following conditions: (i) the breaking point strength is 100 MPa or less; (ii) a linear expansion coefficient of 35 ppm/DEG C or less; and (iii) the storage modulus at 30 DEG C is 2 GPa or more. 本发明提供在SAW滤波器的制造中，在使用热固化性树脂组合物将多个芯片一并地密封后将芯片一个一个地单片化的工序中，能够容易地将芯片单片化的热固化性树脂组合物。根据本发明的热固化性树脂组合物，其是包含热固化性树脂的热固化性树脂组合物，其特征在于，将所述热固化性树脂组合物以100℃加热30分