Immersion cooling system for integrated circuits
Embodiments of the present disclosure provide a cooling system for an integrated circuit device. A cooling system according to the present disclosure includes a coolant tank containing a coolant, a cooling coil disposed within the coolant tank, a refrigerant circulating within the cooling coil, and...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
24.11.2023
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Subjects | |
Online Access | Get full text |
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Summary: | Embodiments of the present disclosure provide a cooling system for an integrated circuit device. A cooling system according to the present disclosure includes a coolant tank containing a coolant, a cooling coil disposed within the coolant tank, a refrigerant circulating within the cooling coil, and a circulation pump disposed within the coolant tank and configured to circulate the coolant within the coolant tank.
本公开的实施例提供了用于集成电路设备的冷却系统。根据本公开的冷却系统包括装有冷却剂的冷却剂箱,设置在冷却剂箱内的冷却盘管,在冷却盘管内循环的制冷剂,以及设置在冷却剂箱内且被配置为使冷却剂箱内的冷却剂循环的循环泵。 |
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Bibliography: | Application Number: CN202310966679 |