PACKAGE STRUCTURE AND METHOD OF FORMING A PACKAGE

• Main Authors: HOU HAOCHENG, HOU SHANGYONG, LI JIANXUN, WANG ZONGDING, ZHENG RONGWEI
• Format: Patent
• Language: Chinese; English
• Published: 24.11.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

In accordance with an embodiment of the present application, a method of forming a package includes forming an inductor die including forming a metal via over a substrate, forming a magnetic housing surrounding the metal via, the metal via and the magnetic housing collectively forming an inductor, and depositing a dielectric layer around the magnetic housing. The method further includes placing the inductor die over a carrier, encapsulating the inductor die in an encapsulant, forming redistribution lines electrically connected to the inductor, and bonding the device die to the redistribution lines. The device die is electrically coupled to the inductor through the redistribution line. In accordance with other embodiments of the present application, a package structure is also provided. 根据本申请的实施例，提供了一种形成封装件的方法，包括形成电感器管芯，其包括在衬底上方形成金属通孔，形成环绕金属通孔的磁性外壳，金属通孔和磁性外壳共同地形成电感器，以及在磁性外壳周围沉积介电层。该方法还包括将电感器管芯放置在载体上方，将电感器管芯封装在密封剂中，形成电连接至电感器的再分布线，以及将器件管芯接合到再分布线。器件管芯通过再分布线电耦合到电感器。根据本申请的其他实施例，还提供了封装件结构。