Polishing device for reducing slurry

• Main Author: LEE SUN WOONG
• Format: Patent
• Language: Chinese; English
• Published: 24.11.2023
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The invention discloses a polishing device for reducing slurry, relates to the technical field of semiconductor processing, and solves the problems that when an existing pad groove rotates, the slurry is difficult to effectively enter the pad groove, and meanwhile, the slurry entering the pad groove is easy to throw out under the centrifugal acting force, so that the amount of the slurry in the groove is small. According to the technical scheme, the polishing pad is characterized by comprising a polishing pad body and a pad groove formed in the surface of the polishing pad body, the pad groove is composed of a plurality of grooves which are not communicated with one another, and the grooves are distributed around the polishing pad body in a divergent mode. The pad groove is designed to be of a divergent structure similar to a slurry flow path, the retention amount of the pad groove is increased, meanwhile, the updating efficiency of slurry in the pad groove is improved, and the polishing efficiency is improve