POWER MODULE AND METHOD FOR MANUFACTURING POWER MODULE

A power module is provided with: a circuit board on which a power semiconductor element is mounted; a base plate to which the circuit board is fixed; a terminal block having a base end surface fixed to the outer surface of the circuit board and facing the surface opposite to the base plate, a tip en...

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Bibliographic Details
Main Author EZUMI MASAHIKO
Format Patent
LanguageChinese
English
Published 21.11.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A power module is provided with: a circuit board on which a power semiconductor element is mounted; a base plate to which the circuit board is fixed; a terminal block having a base end surface fixed to the outer surface of the circuit board and facing the surface opposite to the base plate, a tip end surface to which an external conductor electrically connected to the outside can be fixed, and an intermediate portion extending in a direction away from the surface of the circuit board and electrically connecting the base end surface and the tip end surface; and a reinforcing part which is fixed to at least one of the circuit board and the base plate and reinforces the terminal block, the intermediate part of the terminal block has a receiving surface facing the front end surface side, and the reinforcing part has a suppression surface which is provided so as to face the receiving surface in the direction in which the intermediate part extends. And restricts displacement of the terminal block in a direction awa
Bibliography:Application Number: CN20228025257