Micro OLED packaging structure and preparation method of sealing layer
The invention discloses a micro OLED packaging structure and a preparation method of a sealing layer, the micro OLED packaging structure comprises a CMOS substrate, a metal anode layer, a white light OLED structure layer, the sealing layer and a color filter from bottom to top in sequence, the seali...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
21.11.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses a micro OLED packaging structure and a preparation method of a sealing layer, the micro OLED packaging structure comprises a CMOS substrate, a metal anode layer, a white light OLED structure layer, the sealing layer and a color filter from bottom to top in sequence, the sealing layer is of a three-layer structure and comprises a bottom inorganic layer, an organic hydrophobic layer and a top inorganic layer from bottom to top in sequence, the white light OLED structure layer comprises a structure layer base layer and a cathode layer, and the bottom inorganic layer comprises a bottom inorganic layer, an organic hydrophobic layer and a top inorganic layer. The cathode layer is arranged at the top end of the structural layer base layer; the film packaging effect of the Micro OLED micro display device is greatly improved, meanwhile, the problem of film layer tearing caused by stress mismatching between inorganic film layers is solved, the problem of stress mismatching between the inorganic |
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Bibliography: | Application Number: CN202311209188 |