High-reliability interlayer vertical interconnection structure and implementation method thereof

• Main Authors: LIU JINGBO, YANG HUI, LIN CHENYANG, DENG CHAO, CHEN SHUAI, LI LI, MA ZHENGWEI, ZHANG YIPING, CAO HONGZHI, ZHANG LING, WANG TIANSHI, TANG SIQI, LI LIN, ZHANG YI, ZHANG YU, ZHAO XINGJIAN, FAN XUN, MA XIAOLIN, CHANG YIKUAN
• Format: Patent
• Language: Chinese; English
• Published: 21.11.2023
• Subjects: ANTENNAS, i.e. RADIO AERIALS; BASIC ELECTRIC ELEMENTS; ELECTRICITY

The invention relates to the technical field of three-dimensional circuit manufacturing, and particularly discloses a high-reliability interlayer vertical interconnection structure and an implementation method thereof.The high-reliability interlayer vertical interconnection structure comprises an installation base body, a top radiation layer installed on the installation base body and an elastic rigid-flex feed piece installed on the installation base body; the rigid-flex feed sheet is connected with the top radiation layer; the invention further discloses an implementation method, high precision and high density of a complex special-shaped curved surface and interlayer flexible vertical interconnection of dissimilar materials are realized through a riveted structure of the rigid-flex feed sheet and the top radiation layer, and meanwhile, a horizontal signal of the top radiation layer is converted into a vertical signal of the rigid-flex feed sheet. 本发明涉及立体电路制造技术领域，具体公开了一种高可靠的层间垂直互联结构及其实现方法，高可靠的层间垂直互联结构，包括安装基