High-reliability interlayer vertical interconnection structure and implementation method thereof
The invention relates to the technical field of three-dimensional circuit manufacturing, and particularly discloses a high-reliability interlayer vertical interconnection structure and an implementation method thereof.The high-reliability interlayer vertical interconnection structure comprises an in...
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Main Authors | , , , , , , , , , , , , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
21.11.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to the technical field of three-dimensional circuit manufacturing, and particularly discloses a high-reliability interlayer vertical interconnection structure and an implementation method thereof.The high-reliability interlayer vertical interconnection structure comprises an installation base body, a top radiation layer installed on the installation base body and an elastic rigid-flex feed piece installed on the installation base body; the rigid-flex feed sheet is connected with the top radiation layer; the invention further discloses an implementation method, high precision and high density of a complex special-shaped curved surface and interlayer flexible vertical interconnection of dissimilar materials are realized through a riveted structure of the rigid-flex feed sheet and the top radiation layer, and meanwhile, a horizontal signal of the top radiation layer is converted into a vertical signal of the rigid-flex feed sheet.
本发明涉及立体电路制造技术领域,具体公开了一种高可靠的层间垂直互联结构及其实现方法,高可靠的层间垂直互联结构,包括安装基 |
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Bibliography: | Application Number: CN202311063549 |