METHOD AND DEVICE FOR APPLYING A METAL COATING TO A SURFACE
The invention relates to a method for applying a metal coating to a substrate (2; 2 ') of the surface (8; 8 '), in particular for producing a conductor strip, said method comprising the following steps. Applying an ink to the surface (8; 8 '), wherein the ink comprises at least one me...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
17.11.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to a method for applying a metal coating to a substrate (2; 2 ') of the surface (8; 8 '), in particular for producing a conductor strip, said method comprising the following steps. Applying an ink to the surface (8; 8 '), wherein the ink comprises at least one metal salt of an organic acid or a mixture of such salts. Further, the ink is decomposed by supplying energy to the ink, thereby producing a metal coating from the one or more metal salts. In this case, the metal coating adheres to the surface (8; 8 '). The invention further relates to a device for carrying out the method and to a corresponding ink.
本发明涉及用于将金属涂层施加到基底(2;2')的表面(8;8')上,特别是用于生产导体带的方法,其中该方法包括以下步骤。将油墨施加到表面(8;8')的待涂覆的位置,其中油墨包含有机酸的至少一种金属盐或此类盐的混合物。此外,通过向油墨供应能量来分解油墨,从而由所述一种金属盐或多种金属盐产生金属涂层。在此,金属涂层粘附到待涂覆的位置处的表面(8;8')上。此外,本发明涉及用于进行该方法的装置以及相应的油墨。 |
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Bibliography: | Application Number: CN202180096466 |