Epoxy resin, curable resin composition, and cured product of curable resin composition

• Main Authors: NAKANISHI MASATAKA, SEKI SATOSHI, ITAI MASAYUKI, YOSHIDA KEITA
• Format: Patent
• Language: Chinese; English
• Published: 10.11.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

Provided are an epoxy resin and a curable resin composition which have excellent heat resistance and tracking resistance of a cured product thereof. The epoxy resin is represented by formula (1), and the value obtained by dividing the epoxy equivalent (g/eq.) by the softening point (DEG C) is 2.0 or more and less than 2.2. (In formula (1), a plurality of Rs are independently present and each represents a methyl group or a hydrogen atom; ) # imgabs0 #, n being the average value of the number of repetitions and being a real number of 1-10 本发明提供一种其硬化物的耐热性、及耐漏电起痕特性优异的环氧树脂、硬化性树脂组合物。一种环氧树脂，由下述式(1)表示，将环氧当量(g/eq.)除以软化点(℃)而得的值为2.0以上且小于2.2。(式(1)中，存在多个的R独立存在，表示甲基或氢原子；n为重复数的平均值，且为1～10的实数)#imgabs0#