Semiconductor device and manufacturing method thereof

The invention provides a semiconductor device and a preparation method thereof, the semiconductor device comprises a carrier plate, a first chip, a second chip, a connecting line and a packaging layer, and the carrier plate is provided with a first area and a second area arranged around the first ar...

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Bibliographic Details
Main Authors ZHU CHENGKUN, ZHU YONGHUA, SHAO XIAODONG
Format Patent
LanguageChinese
English
Published 10.11.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention provides a semiconductor device and a preparation method thereof, the semiconductor device comprises a carrier plate, a first chip, a second chip, a connecting line and a packaging layer, and the carrier plate is provided with a first area and a second area arranged around the first area; the first chip and the second chip are sequentially stacked on the first area of the carrier plate, the first chip and the second chip are provided with a first bonding pad, a second bonding pad, a redistribution layer and a first insulating layer, in the direction from the first chip to the carrier plate, the projection area of the second bonding pad is larger than that of the first bonding pad, and the first insulating layer is annular; a welding spot metal welding ball formed at one end of the connecting line is connected with the carrier plate located in the second area, two welding spot fishtails formed at the other end of the connecting line are connected with the second bonding pad, and the distance betw
Bibliography:Application Number: CN202311011358