Photonic integration in semiconductor package

• Main Authors: CAO LIMING, KARIKARAN SANDEEP, MAYUKA MICHAEL, SARASWATULA, DEEPAK, ZHAO ZIQUN, SHARIFI REZA, RAMAKRISHNAN ARUN
• Format: Patent
• Language: Chinese; English
• Published: 10.11.2023
• Subjects: OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS

The invention relates to photonic integration in a semiconductor package. An apparatus includes a substrate including one or more wiring layers and an optical module coupled to the substrate. The optical module includes a photonic integrated circuit (PIC) and an electronic integrated circuit (EIC), wherein the photonic integrated circuit is at least partially embedded within the substrate. The apparatus further includes an optical fiber coupler coupled to at least one of the substrate or the PIC, wherein the PIC is configured to transmit or receive optical signals via the optical fiber coupler. 本公开涉及半导体封装中的光子集成。一种设备包含包括一或多个布线层的衬底及耦合到所述衬底的光学模块。所述光学模块包含光子集成电路PIC及电子集成电路EIC，其中所述光子集成电路至少部分嵌入于所述衬底内。所述设备进一步包含耦合到所述衬底或PIC中的至少一者的光纤耦合器，其中所述PIC经配置以经由所述光纤耦合器发射或接收光学信号。