Hole-filling copper plating solution, preparation method thereof and hole-filling copper plating method

• Main Authors: LU WENXIN, DU TENGHUI, TAN WENLING
• Format: Patent
• Language: Chinese; English
• Published: 10.11.2023
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention provides a porefilling copper plating solution, a preparation method thereof and a porefilling copper plating method. According to the hole-filling copper plating solution, a good hole-filling effect is achieved, 3 mil laser holes, 4 mil laser holes and 5 mil laser holes are filled at...